Lead Frame Product-宏茂微电子（上海）有限公司

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三维封装产品

宏茂微于2018年扩充3D NAND Flash产品堆栈式封装服务包含Raw NAND , EMMC , UFS等产品封装测试项目。于2018年工程验证完毕，2019年第一季度完成量产，宏茂微广招各界人才完成此项纪录。

Lead Frame Product
Substrate Product

TSOP I

- TSOP-I 48L

BGA

- BGA272B
- BGA132B
- BGA153B
- BGA252B

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