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常规封装产品

宏茂微于2005年开始量产常规封装产品，导入车规、工规、消费级产品。常规封装已有10余年生产经验，逐年认证车规TS16949证书，逐步由TSOP系列量产、BGA系列产品的量产、MEMS系列产品量产到2019年DFN系列产品量产。

Lead Frame Product
Substrate Product

TSOP I&TSOP II
QFP&LQFP
SOP
DFN&QFN

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- LQFP 128L
- QFP 80L
- QFP 100L
- QFP 128L
- LQFP 100L

- SOP8L(150mil)
- SOP8L(208mil)

- DFN8L 6X8

MiniBGA
FBGA
LGA
PBGA

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- PBGA 119B(14X22)

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